Advanced Materials

Epoxy Siloxane Resins

Polyset is continuing to develop a family of novel siloxane-based monomers and oligomers that are especially attractive for such applications as microelectronics, photonics, composites, coatings and adhesives. These novel materials bear reactive functional groups consisting of cyclohexyl epoxy, glycidyl ether, vinyl ether and acrylate moieties as well as combinations of these groups. In the past, Polyset has also developed a series of proprietary curing agents that can be applied to these and other similar materials. Combination of the novel siloxane-based resins with these curing agents allows these materials to be cured thermally or using UV or e-beam irradiation. Dual thermal and radiation cure systems may also be employed.

Monomer Product
Description
Features
PC-1000Difunctional Epoxy TerminatedLow shrinkage
PC-1035Difunctional Epoxy TerminatedHigher MW than PC-1000, flexibizer
Oligomer Product
Description
Features
PC-2000Multifunctional 20,000 g/mol resinFast cure speeds, high adhesion
PC-2004Multifunctional 1.000 g/mol resinLower viscosity material suitable for inks
PC-2011Aromatic-Epoxy CopolymerHigher Temperature Resistance, RI
PC-2021High EEW CopolymerLow dielectric
PC-2026Flouroalkyl-Epoxy CopolymerLow RI